一、GOB Process Concept
GOB is the abbreviation for GLUE ON THE BOARD board adhesive. GOB process is a new type of optical thermal conductive nano filling material, which uses a special process to achieve a frosting effect on the surface of LED display screens by treating conventional LED display screen PCB boards and their SMT lamp beads with double fog surface optics. It improves the existing protection technology of LED display screens and innovatively realizes the conversion and display of display point light sources from surface light sources. There is a vast market in such fields.
二、GOB process solves industry pain points
At present, traditional screens are completely exposed to luminescent materials and have serious defects.
1. Low protection level: non moisture-proof, waterproof, dustproof, shockproof, and anti-collision. In humid climates, it is easy to see a large number of dead lights and broken lights. During transportation, it is easy for the lights to fall off and break. It is also susceptible to static electricity, causing dead lights.
2. Great eye damage: prolonged viewing can cause glare and fatigue, and the eyes cannot be protected. In addition, there is a "blue damage" effect. Due to the short wavelength and high frequency of blue light LEDs, the human eye is directly and long-term affected by blue light, which can easily cause retinopathy.
三、 Advantages of GOB process
1. Eight precautions: waterproof, moisture-proof, anti-collision, dustproof, anti-corrosion, blue light proof, salt proof, and anti-static.
2. Due to the frosted surface effect, it also increases color contrast, achieving the conversion display from viewpoint light source to surface light source, and increasing the viewing angle.
四、 Detailed explanation of GOB process
The GOB process truly meets the requirements of LED display screen product characteristics and can ensure standardized mass production of quality and performance. We need a complete production process, reliable automated production equipment developed in conjunction with the production process, customized a pair of A-type molds, and developed packaging materials that meet the requirements of product characteristics.
The GOB process must currently pass through six levels: material level, filling level, thickness level, level level, surface level, and maintenance level.
(1) Broken material
The packaging materials of GOB must be customized materials developed according to GOB's process plan and must meet the following characteristics: 1. Strong adhesion; 2. Strong tensile force and vertical impact force; 3. Hardness; 4. High transparency; 5. Temperature resistance; 6. Resistance to yellowing, 7. Salt spray, 8. High wear resistance, 9. Anti static, 10. High voltage resistance, etc;
(2) Fill
The GOB packaging process should ensure that the packaging material completely fills the space between the lamp beads and covers the surface of the lamp beads, and firmly adheres to the PCB. There should be no bubbles, pinholes, white spots, voids, or bottom fillers. On the bonding surface between PCB and adhesive.
(3) Thickness shedding
Consistency of adhesive layer thickness (accurately described as the consistency of adhesive layer thickness on the surface of the lamp bead). After GOB packaging, it is necessary to ensure the uniformity of the adhesive layer thickness on the surface of the lamp beads. At present, the GOB process has been fully upgraded to 4.0, with almost no thickness tolerance for the adhesive layer. The thickness tolerance of the original module is as much as the thickness tolerance after the completion of the original module. It can even reduce the thickness tolerance of the original module. Perfect joint flatness!
The consistency of adhesive layer thickness is crucial for the GOB process. If not guaranteed, there will be a series of fatal problems such as modularity, uneven splicing, poor color consistency between black screen and lit state. happen.
(4) Leveling
The surface smoothness of GOB packaging should be good, and there should be no bumps, ripples, etc.
(5) Surface detachment
Surface treatment of GOB containers. At present, surface treatment in the industry is divided into matte surface, matte surface, and mirror surface based on product characteristics.
(6) Maintenance switch
The repairability of packaged GOB should ensure that the packaging material is easy to remove under certain conditions, and the removed part can be filled and repaired after normal maintenance.
五、 GOB Process Application Manual
1. The GOB process supports various LED displays.
Suitable for small pitch LED displays, ultra protective rental LED displays, ultra protective floor to floor interactive LED displays, ultra protective transparent LED displays, LED intelligent panel displays, LED intelligent billboard displays, LED creative displays, etc.
2. Due to the support of GOB technology, the range of LED display screens has been expanded.
Stage rental, exhibition display, creative display, advertising media, security monitoring, command and dispatch, transportation, sports venues, broadcasting and television, smart city, real estate, enterprises and institutions, special engineering, etc.
Post time: Jul-04-2023
